Manufacturers of surface mount electronic components -- such as chip capacitors, cellular phone components and connectors -- need polymers that can deliver a range of high-performance capabilities. These include high temperature performance – over 260°C – often needed when with today’s lead free solder is used -- dimensional stability, strength, pin retention, and ease of processing. Our family of AMODEL polyphthalamides gives design engineers a top-choice solution for cost-effectively meeting these challenges. And our XYDAR liquid crystal polymers offer the high flow needed for filling thin-wall components.

Overall, AMODEL PPA resin can offer a superior combination of higher HDT, lower moisture absorption, higher stiffness and lower thermal expansion than competitive materials such as HTN, PA-4,6, PCT, PPS and SPS. Plus, AMODEL resin can offer good molding productivity by allowing faster cycle times than many other resins.

Flame retardant grades to consider include our hot-water moldable AMODEL AF-4133 VO and AFA-4133 VO Z, which offer fast cycle times and high mechanical properties. Hot-water moldable AMODEL AFA-6133 VO Z is hot runner capable and may offer higher flow with slightly lower mechanical properties. AMODEL AFA-6145 VO Z features 45% glass loading for enhanced strength and stiffness. Hot-oil moldable AMODEL AF-1133 and AF-1145 may be selected where superior surface finish or higher mechanical properties are required.

For applications requiring maximum flow, XYDAR LCP can fill your need. Warp-resistance and high thermal capabilities may also be achieved. LCPs are naturally UL-V0. The grade to consider is  XYDAR G-930.