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With rising under hood temperatures, the trends toward the use surface mount circuit board assembly processes and lead-free solder, and longer life expectations, traditional connector materials such as polybutylene terephthalate (PBT) and aliphatic polyamides (PA) are often incapable of meeting these more challenging performance requirements.
AMODEL polyphthalamide and XYDAR liquid crystal polymer are ideally suited for these more demanding assembly and end use environments. AMODEL resins such as AS-4145 HS and A-1133 HS are particularly well suited for header connector designs. In instances, where more elongation is required as in snap fit designs, AMODEL AT-6115 HS is a popular choice. For the most demanding applications, including those that require a resin with exceptional flow characteristics or very high continuous use temperatures up to 240ºC (464ºF), XYDAR G-930 LCP is an excellent material of choice.
Follow the links below to see examples of connector applications
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